Having received much positive feedback from partners and visitors during its first announcement at Computex 2024, Sea Sonic is proud to launch the new Seasonic FOCUS GX (2024) Series. In the footsteps of the popular FOCUS Series power supplies, this new iteration introduces innovative features that aspire to follow the legacy and position the FOCUS GX (2024) at the new Center of Attention.
Introducing a Technological Milestone: OptiSink
The FOCUS GX (2024) was redesigned with a brand new PCB layout and is produced during a new manufacturing process involving automated surface mount technology. Improved design also includes the use of smaller MOSFETs and heat sink components, which increases the internal space within the PSU to promote better airflow. All these enhancements not only improve the overall quality of the FOCUS GX (2024) Series, but also make it more efficient and more reliability in the long run.
Transitioning from Traditional to New Technology
Compared to traditional thermal solutions, this upgraded layout, termed OptiSink, increases internal space by approximately 48 %, facilitating better air movement. At full load, the power supply fan can exchange heat at a significantly faster rate due to the larger space available, resulting in improved overall efficiency, and promoting an environmentally friendly operation.
Compared to traditional thermal solutions, this upgraded layout, termed OptiSink, increases internal space by approximately 48 %, facilitating better air movement. At full load, the power supply fan can exchange heat at a significantly faster rate due to the larger space available, resulting in improved overall efficiency, and promoting an environmentally friendly operation.
Key Thermal Design Innovation
During manufacturing, the MOS (Metal-Oxide Semiconductor) is directly soldered onto the copper surface of the PCB (Printed Circuit Board), in order to harness the superior thermal conductivity of copper. This approach contrasts sharply with the older method of using screws and thermal pads to mount the MOS onto aluminium heat sinks.
During manufacturing, the MOS (Metal-Oxide Semiconductor) is directly soldered onto the copper surface of the PCB (Printed Circuit Board), in order to harness the superior thermal conductivity of copper. This approach contrasts sharply with the older method of using screws and thermal pads to mount the MOS onto aluminium heat sinks.
Features
- ATX 3.1 and PCIe 5.1
- 80 Plus Gold Certified
- Fully Modular Cabling Design
- Native 12V-2×6 Cable
- Compact Size (140 mm)
- 135 mm Fluid Dynamic Bearing (FDB) Fan
- Seasonic Digital Fan Control
- Highly Reliable Japanese 105°C aluminium Electrolytic Capacitors
- Tight Voltage Regulation (12 V, 5 V and 3.3 V) [± 3%]
- Cable-free Connection Design
- Multi-GPU Technology Support
- 10 years warranty
Availability and MSRP
- China: Available, Europe: October 2024, North America: Mid-November 2024, ROW: End of Q3 / Q4 2024 onwards
- FOCUS GX-750: $129.99 (USA) / €119.90 (Europe) / $119.99 (ROW)
- FOCUS GX-850: $149.99 (USA) / €139.90 (Europe) / $139.99 (ROW)
- FOCUS GX-1000: $189.99 (USA) / €169.90 (Europe) / $169.99 (ROW)
- FOCUS GX-750 White: $139.99 (USA) / €129.90 (Europe) / $129.99 (ROW)
- FOCUS GX-850 White: $159.99 (USA) / €149.90 (Europe) / $149.99 (ROW)
- FOCUS GX-1000 White: $199.99 (USA) / €199.90 (Europe) / $179.99 (ROW)
Source: Sea Sonic
