MediaTek today announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.
The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4 nm octa-core process, combining one ultra-Cortex-X2 core operating at up to 3.20 GHz (compared to 3.05 GHz with the Dimensity 9000) with three super Cortex-A710 cores and four efficiency Cortex-A510 cores. The advanced CPU architecture and Arm Mali-G710 MC10 graphics processor built into the new chipset provide more than a 5% boost in CPU performance and more than 10% improvement in GPU performance.
“Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device makers always have access to the most advanced high-performance features and the latest mobile technologies, making it possible for their top-tier smartphones to stand out,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit. “With a suite of top-tier AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, seamless streaming and an all-around better user experience.”
The Dimensity 9000+ is the latest addition to the Dimensity 9000 series of flagship smartphone chipsets, which are designed for the growing bandwidth demands of the mobile market. The integrated LPDDR5X supports 8 MB L3 CPU cache and 6 MB of system cache. Additionally, the chipset integrates MediaTek’s fifth generation Application Processor Unit (APU 5.0) for powerful AI computing capabilities in a power-efficient design.
Key features of the MediaTek Dimensity 9000+ include:
- MediaTek Imagiq 790: The flagship 18-bit HDR-ISP supports 320MP, as well as simultaneous triple camera 18-bit HDR video recording. The powerful 9 Gpixel/s ISP also supports 4K HDR Video + AI noise reduction that enables the highest quality results even in extreme low-light scenarios.
- Leading 3GPP Release-16 5G Modem: The integrated 5G modem amplifies sub-6 GHz performance up to 7 Gbps downlink using 3CC Carrier Aggregation (300 MHz) and supports R16 UL enhancement. The Dimensity 9000+ also integrates 5G/4G Dual SIM Dual Active support and MediaTek’s 5G UltraSave 2.0 power-saving enhancement suite for improved efficiency.
- MediaTek MiraVision 790: The Dimensity 9000+ supports the latest 144 Hz WQHD+ displays or super-fast 180 Hz FullHD+ displays, while optimizing power efficiency with MediaTek’s Intelligent Display Sync 2.0 technology. Furthermore, MediaTek’s latest Wi-Fi Display technology can support up to 4K60 HDR10+ video.
- Wi-Fi 6E, New GNSS with Beidou III-B1C and New Bluetooth 5.3: Smartphone users can enjoy seamless connectivity thanks to the chip’s support for the latest Wi-Fi, Bluetooth and GNSS standards.
Smartphones powered by the MediaTek Dimensity 9000+ are expected to be released in Q3 2022.
For more information, visit the product page.
