Qualcomm Technologies, Inc. today unveiled the Qualcomm FastConnect 7900 Mobile Connectivity system, the first to deliver AI-optimized performance and integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip. Utilizing AI, FastConnect 7900 adapts to specific use cases and environments, delivering meaningful optimizations across power consumption, network latency and throughput. FastConnect 7900 integrates Ultra Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding to create a powerful suite of proximity technologies that enable security rich device discovery, access, and control.
Adding to its technical prowess, FastConnect 7900 leverages a new class of RF front-end modules, and next-generation implementation of High Band Simultaneous technology, a key Wi-Fi 7 era innovation at the heart of multi-device experiences and foundational to Qualcomm® Expanded Personal Area Network (XPAN) and Snapdragon Seamless experiences.
“FastConnect 7900 is a technological feat, leveraging AI to raise the bar and deliver leading Wi-Fi 7 and Bluetooth capabilities while integrating Ultra Wideband all on a single 6nm chip,” said Javier del Prado, vice president and general manager for mobile connectivity, Qualcomm Technologies, Inc. “Building on the legacy of our first-gen Wi-Fi 7 offering found in millions of devices today, FastConnect 7900 creates a new way to connect. The system brings next-level capabilities across AI, proximity, and multi-device experiences into the devices we love most.”
For more information about the Qualcomm FastConnect 7900 Mobile Connectivity System, visit our website. For more MWC Barcelona announcements from Qualcomm, including Wi-Fi 7 in auto, check our OnQ blog. To view further industry support, check here.
