Features
- The finest crafted heat spreader with unique trench design
- High-efficiency aluminum heat spreader
- 10 layers of circuit board
- Selected high quality SAMSUNG original IC chips
- 1.2V~1.4V ultra low working voltage
- Support Intel XMP 2.0 smart overclocking technology
- QVL approved by motherboard manufactures in the market
QVL approved by motherboard manufacturers
Multiple compatibility verifications with mainstream DDR4 motherboards to make sure its stability with all motherboards on the QVL(Qualified Vendor List). Therefore, you wouldn’t’ have to worry about compatibility issues when purchasing high speed memory.
With unique trench design and improve radiating performance 10%
The Team Group design team had built a heat spreader with an all new exterior design concept. The overclocking memory module with highest specification is built by top notch aluminum extrusion process and CNC machining. The unique trench design can increase the radiating area to improve radiating efficiency. XTREEM combines simple and magnificent design with its top specification overclocking memory module. The clean, sleek lines are able to magnify its high speed specification.
10layers of circuit board largely improves stability
The number of PCB layers is 25% more than normal memories. This provides better efficiency and performance since the power layer and the signal layer has a farther distance between each other. Without the interference between the power and the signal, it can offer players the overclocking pleasure and a high stability overclocking memory module.
Selected high quality SAMSUNGoriginal IC chips
Team Group insists on using high quality SAMSUNG original IC chips and passed through various rigorous internal tests. Its high reliability makes players feel at ease.
XMP2.0 1step overclocking technology
All XTREEM series support Intel XMP 2.0. It is only one click away to experience the high speed sensation of overclocking.
For more information … please visit TeamGroup’s website … here.
