Lenovo is thrilled to unveil our thinnest ThinkPad ever1, ThinkPad X1 Titanium Yoga. Covered in titanium material, it’s just over 11mm thin and features a...
NETGEAR, Inc. (NASDAQ: NTGR), the worldwide leading provider of advanced networking products for home and office, has announced two new mobile products: the Industry’s first...
NETGEAR, Inc. (NASDAQ: NTGR), the worldwide leading provider of award-winning advanced networking products for home and office has today announced, during the historic virtually-hosted CES...
Today, at Intel’s Memory and Storage 2020 event, the company highlighted six new memory and storage products to help customers meet the challenges of digital...
During the first day of the Snapdragon Tech Summit Digital, Qualcomm Incorporated President, Cristiano Amon took the virtual stage with global industry leaders to highlight...
MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7 nm SoC designed to bring advanced 5G capabilities and experiences to the mass...
Micron Technology, Inc., today announced the launch of uMCP5, the industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. Now ready...
Lenovo™ is very excited to unveil the latest addition to our premium X1 portfolio, ThinkPad™ X1 Nano. The lightest ThinkPad ever at just 1.99 pounds...
Qualcomm Technologies, Inc. announced a new 5G mobile platform in the 7-series, the Qualcomm Snapdragon 750G 5G Mobile Platform, which enables truly global 5G with...
Qualcomm Technologies, Inc. today announced at Internationale Funkausstellung (IFA) Berlin the Qualcomm Snapdragon 8cx Gen 2 5G compute platform, the company’s most advanced and efficient...
MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek’s Dimensity series family. The 7 nm Dimensity 800U chipset...
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