MediaTek today announced the Dimensity 720, its latest 5G SoC that will give consumers access to premium 5G experiences on mid-tier smartphones. The Dimensity 720,...
The University of Florida and NVIDIA Tuesday unveiled a plan to build the world’s fastest AI supercomputer in academia, delivering 700 petaflops of AI performance....
Qualcomm Technologies, Inc. unveiled the Qualcomm Snapdragon 865 Plus 5G Mobile Platform, a follow-on to the flagship Snapdragon 865 that has powered more than 140...
HTC VIVE, a global leader in innovative technology, today officially announces it will enter the cloud software business with the VIVE XR Suite offering at...
ASUS AI Noise-Canceling Mic Adapter with USB-C to 3.5 mm connection delivers unmatched crystal-clear communication. AI Noise‑Canceling technology enhances headset microphones by eliminating background noise...
XRSPACE, the company pioneering the next generation of social reality, has today announced the launch of the world’s first social VR platform designed for mass...
ASUS today announced Tinker Edge R, a single-board computer (SBC) specially designed for AI applications. It uses a Rockchip RK3399Pro NPU, a machine-learning (ML) accelerator...
Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of ‘Flashbolt’, its third-generation High Bandwidth Memory 2E (HBM2E). The new...