Today, Intel launched Intel Core processors with Intel Hybrid Technology, code-named “Lakefield.” Leveraging Intel’s Foveros 3D packaging technology and featuring a hybrid CPU architecture for...
Woah … this Galaxy Book features a Foveros based chip, a high-performance three-dimensional integrated circuit (3D IC). See, why didn’t Intel use this for...
The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various...
Today, at a launch event in New York City, Microsoft previewed the Surface Neo, a category-defining device co-engineered with Intel. The dual-screen device will be...
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