SK hynix Inc. (or “the company”, www.skhynix.com) showcased today the sample of the 321-layer 4D NAND, making public the progress on its development of the...
ASUS today revealed the all-new Zenfone 9 smartphone at a virtual launch event. Zenfone 9 is a totally redesigned compact 5.9-inch device with high performance...
Samsung has developed the industry’s highest performing Universal Flash Storage (UFS) 4.0 storage solution, which has received JEDEC® board of director approval. What is UFS...
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today unveiled an extensive lineup of cutting-edge automotive memory solutions designed for next-generation autonomous...
Micron Technology, Inc., today announced the launch of uMCP5, the industry’s first universal flash storage (UFS) multichip package with low-power DDR5 (LPDDR5) DRAM. Now ready...
Further cementing its position as a leading provider of storage for next-gen mobile devices, KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.), the U.S.-based subsidiary...
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of Universal Flash Storage...
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 512-gigabyte (GB) embedded...
Samsung Electronics, the world leader in advanced memory technology, today unveiled the industry’s first removable memory cards based on the JEDEC Universal Flash Storage (UFS)...
This website uses cookies to improve your experience. We'll assume you're ok with this, but you can opt-out if you wish. AcceptRead More